2024 Funding Proposal Call #2

2024 Funding Proposal Call #2

Published On: March 4, 2024Categories: Uncategorized

The AFRL Regional Network – Midwest is excited to announce that submissions are now open for the second funding call for 2024! This call will seek proposals from researchers who are members of the Midwest Regional Network, along with their AFRL and additional collaborators. Full details of the proposal process and submission portal can be found here.

Project Submission Opens: NOW OPEN!
Pre-proposal (Phase I) Due Date: March 22, 2024, 5PM EST

Application Process

Proposals will be submitted via Qualtrics.

Pre-proposal (Phase I): Complete a short form describing the project, collaborators’ names and organizations, connection to the AFRL mission, AFRL interest, opportunities for AFRL S&E personnel exchanges, and potential for technical transition. Proposals will be reviewed against established criteria, and comments will be provided to the proposers. Based on the assessment, you may be invited to submit a full proposal for Phase II review.

Our primary focus areas are:

  • Hypersonics
  • Microelectronics
  • Energetic materials
  • On Orbit Servicing, Assembly, and Manufacturing (previous known as ISAM)
  • Space domain awareness

Special consideration will be given to proposals with the following topics:

  • Alternate Processes to Develop Cathode Ray Tubes
  • Application of Carbon Nanotubes via CVD
  • Automated tool to combine circuit card imagery from different image modalities (e.g., X-Ray and THz) for image tech.  For additional information click here.
  • Quantum Computing
  • Hardware-in-the-loop Modeling and Simulation for Developmental Testing
  • High Strain Rate Materials
  • High Temperature Thermocouples
  • Hypersonic Modeling & Simulation
  • Modeling and Simulation Efforts to Minimize Testing and/or Aid in Down Select for EM systems
  • Performance Simulations for Energetic Materials
  • 3D SAR ATR
  • Detection of Hypersonic Signatures via Sensor Fusion and Aggregation
  • Detection of Space Debris with Existing Orbiting SAR Sensors
  • Environmentally Induced Noise in Microelectronics as Source of Sensor Data
  • Event Based Sensing
  • Lidar Tomography
  • Low-cost Cryocooler
  • Multi-channel Acoustic Transceiver
  • Passive Sensing Fusion and Tracking on Small UAVs
  • Photonic Structures for MWIR Imaging Arrays
  • Real-time Monitoring of Device Thermal Characteristics under RF stress
  • Single/entangled Photon Detection
  • Tools (software) to ID elements of Artificial Intelligence/Machine Learning (AI/ML) in code to understand the functionality.  For additional information click here.
  • Ultrasonic Phased Array Transducer
  • Vertical Gallium Nitride Device

 

We are happy to elaborate or provide more specific information on needs upon request.  Please email our director with these requests: smanni@purdue.edu

Thank you so much, and we look forward to reviewing your submissions!

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